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Silicon nitride (Si₃N₄) is a high-performance ceramic material with outstanding high-temperature resistance, high strength, high hardness, wear resistance, thermal shock resistance and excellent chemical stability. It has a low density, a small coefficient of friction and good electrical insulation. It is widely used in mechanical engineering (bearings, cutting tools), the automotive industry (turbochargers), electronics and semiconductors, aerospace and other fields, especially in extreme working conditions.
Cas No. :
12033-89-5Molecular Formula :
Si₃N₄Density :
3.44 g/cm³Melting point :
~1900°CHS code :
2850000090Place of Origin :
ChinaGrade :
Industrial gradeApperance :
White powderBasic information
Silicon nitride (Si₃N₄, also known as tetra-nitrosilicon) has the molecular formula Si₃N₄, with a molecular weight of 140.28. Its EINECS number is 234-796-8. It is a grayish-white powder, featuring two crystal forms: α and β. Its melting point is approximately 1900℃, with a density of 3.44g/cm³. It is highly resistant to high temperatures, has high strength and hardness, is corrosion-resistant, and is soluble in hydrofluoric acid but insoluble in water and dilute acids. It is widely used in ceramic materials, high-temperature bearings, cutting tools, turbine components, electronic insulating parts, etc.
Specification

1: As the base material for silicon nitride ceramics, these ceramics are used to manufacture finished products such as ceramic bearings, ceramic tools, and ceramic valves. Due to their high hardness and high-temperature resistance, they can replace metal components and adapt to extreme working conditions.
2: It is used for manufacturing components such as bearings and sealing rings. With its high hardness and low friction coefficient, it can enhance the service life of equipment under high-speed/ heavy-load conditions.
3: As an insulating layer for integrated circuits and a substrate material for heat dissipation, it utilizes high insulation properties and low thermal expansion coefficient to meet the precise heat dissipation and electrical performance requirements of semiconductor devices.
4: Used for thermal protection coatings of spacecraft and components of rocket engines, it features high resistance to extreme temperatures and corrosion, enabling it to withstand the rigorous tests of space and high-thrust environments.
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